ポリイミド金属積層体の製造方法

Title:

ポリイミド金属積層体の製造方法

Document Type and Number:

Japanese Patent JP5598619

Kind Code:

B2

Abstract:

Disclosed is a polyimide film having improved adhesiveness to an adhesive and/or adherence to a metal layer. The polyimide film has at least a polyimide layer (b) and a polyimide layer (a) formed contacting the polyimide layer (b), wherein the polyimide layer (a) is a polyimide formed from a tetracarboxylic dianhydride component and a diamine component containing a diamine compound represented by general formula (1): wherein R 1 denotes a hydrogen atom, an alkyl group having 1 to 12 carbon atoms or an aryl group, and R 2 denotes an alkyl group having 1 to 12 carbon atoms or an aryl group.

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Inventors:

Shinichiro Ohama
Shinji Kuno
Hiroaki Yamaguchi
Yoshiyuki Oishi
Miura 徹
Yokozawa Italian 裕
Masafumi Koda
Kosuke Oishi

Application Number:

JP2014008448A

Publication Date:

October 01, 2014

Filing Date:

January 21, 2014

Export Citation:

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Assignee:

Ube Industries, Ltd.

International Classes:

B32B27/34; B05D7/04; B05D7/24; C08G73/10

Attorney, Agent or Firm:

Katsuhiro Ito
Akiko Ono

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