Title:
METHOD FOR MANUFACTURING RING AND RING POLISHING DEVICE
Document Type and Number:
Japanese Patent JP2018051720
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To make it possible to perform processing of a width direction end of a ring irrespective of variation in a plate thickness of the ring.SOLUTION: A polishing device 30 comprises: a slewing gear 31 which revolves a ring body 23 while applying a tensile force onto the ring body 23; an outer peripheral side polishing roll 41 which is located on an outer peripheral side of the ring body 23 set on the slewing gear 31, and on which an L-shaped groove 42 having a concaved circular arc part at a corner part is formed in a circumferential direction; and an inner peripheral side polishing roll 46 which is located on an inner peripheral side of the ring body 23, and on which an L-shaped groove 47 having a concaved circular arc part at a corner part is formed in a circumferential direction. The concaved circular arc part of the L-shaped groove 42 is pressed against the ring body 23 from an outer peripheral side toward an inner peripheral side in a thickness direction of the ring body 23 while rotating the outer peripheral side polishing roll 41, and the concaved circular arc part of the L-shaped groove 47 is pressed against the ring body 23 from the inner peripheral side toward the outer peripheral side in the thickness direction of the ring body 23 while rotating the inner peripheral side polishing roll 46.SELECTED DRAWING: Figure 4
More Like This:
Inventors:
OBAYASHI TAKASHI
ITO YOHEI
KOHAMA ATSUSHI
ITO YOHEI
KOHAMA ATSUSHI
Application Number:
JP2016193487A
Publication Date:
April 05, 2018
Filing Date:
September 30, 2016
Export Citation:
Assignee:
AISIN AW CO
International Classes:
B24B9/04; B24B9/00; F16G5/16
Domestic Patent References:
| JP2006124757A | 2006-05-18 | |||
| JPH11345788A | 1999-12-14 | |||
| JP2002248522A | 2002-09-03 |
Attorney, Agent or Firm:
Aitec International Patent Office