Title:
A manufacturing method, a semiconductor device, and a wire bonding apparatus of a semiconductor device
Document Type and Number:
Japanese Patent JP6166458
Kind Code:
B2
Abstract:
A semiconductor device manufacturing method includes: raising and moving a bonding tool, while paying out a wire, in a direction from a second toward a first bonding point to form in the wire a cut portion bent in a vicinity of the second bonding point; lowering and moving a tip of the bonding tool to the cut portion; lowering the bonding tool vertically to thin the cut portion; raising the bonding tool while paying out the wire; and moving the bonding tool in a direction away from the first and second bonding points and along a wire direction connecting the first and second bonding points and then cutting the wire at the cut portion to form a wire tail. This allows the length of the wire tail to be adjusted easily and efficiently to be constant.
Inventors:
Naoki Sekine
Application Number:
JP2016504053A
Publication Date:
July 19, 2017
Filing Date:
February 10, 2015
Export Citation:
Assignee:
Shinkawa Co., Ltd.
International Classes:
H01L21/60; H01L21/607
Domestic Patent References:
| JP63001039A | ||||
| JP2005123388A |