Title:
A manufacturing method of surface treatment copper foil
Document Type and Number:
Japanese Patent JP6030401
Kind Code:
B2
Abstract:
An object of the present invention is to provide a surface-treated copper foil that decreases little in tensile strength even when subjected to a high-temperature heat treatment for a long period of time, a method for manufacturing the surface-treated copper foil, and a negative electrode material for a current collector and a nonaqueous secondary cell that use the surface-treated copper foil. To achieve this object, provided is a surface-treated copper foil comprising zinc-containing surface-treated layers, 20 mg/m2 to 1000 mg/m2 per side, on both sides of a copper foil containing trace constituents of one, two, or more components selected from carbon, sulfur, chlorine, and nitrogen, the total of these components being 100 ppm or more; the surface-treated copper foil characterized in being subjected to a pre-annealing treatment of heating in a temperature range of 200 to 280°C.
Inventors:
Michi Tashiro
Ayumu Tateoka
Ayumu Tateoka
Application Number:
JP2012227367A
Publication Date:
November 24, 2016
Filing Date:
October 12, 2012
Export Citation:
Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
C23C10/28; C22C9/00; C22F1/00; C22F1/08; C23C30/00; C25D5/50; H01M4/64; H01M4/66
Domestic Patent References:
| JP8051281A | ||||
| JP7231161A | ||||
| JP2000165037A | ||||
| JP10330983A | ||||
| JP2005251429A |
Foreign References:
| WO2012070589A1 | ||||
| WO2012070591A1 |
Attorney, Agent or Firm:
Katsuhiro Yoshimura
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