Title:
A manufacturing method of a vibrating member
Document Type and Number:
Japanese Patent JP5911085
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To make a vibration member of an oscillation device thinner.SOLUTION: A vibration member 10 is deposited on a base material 100 by using, for instance, a sputtering method. Then a first electrode layer 26 is deposited on the vibration member 10 by using, for instance, the sputtering method. Then a piezoelectric layer 22 is deposited on the first electrode layer 26 by using, for instance, the sputtering method. Then a second electrode layer 24 is deposited on the piezoelectric layer 22 by using, for instance, the sputtering method. Further, the piezoelectric layer 22 may be formed by using a spraying method or an aerosol deposition method.
Inventors:
Yasuharu Onishi
Jun Kuroda
Yuichiro Kishinami
Yukio Murata
Motoki Komoda
Tachiya Uchikawa
Shigeo Sato
Jun Kuroda
Yuichiro Kishinami
Yukio Murata
Motoki Komoda
Tachiya Uchikawa
Shigeo Sato
Application Number:
JP2010166548A
Publication Date:
April 27, 2016
Filing Date:
July 23, 2010
Export Citation:
Assignee:
NEC
International Classes:
H04R31/00; H01L41/09; H01L41/22; H01L41/257; H01L41/314; H01L41/316; H04R3/00; H04R17/00
Domestic Patent References:
| JP2002076291A | ||||
| JP58127799U | ||||
| JP2006203077A | ||||
| JP8107238A | ||||
| JP2007123353A | ||||
| JP10286953A | ||||
| JP2007005632A | ||||
| JP2005252130A |
Attorney, Agent or Firm:
Shinji Hayami