Title:
A manufacturing method of a wafer with a concavo-convex film, and a wafer with a concavo-convex film
Document Type and Number:
Japanese Patent JP5915062
Kind Code:
B2
Inventors:
Susumu Takada
Kuraseko Emi
Motoyuki Suzuki
Kuraseko Emi
Motoyuki Suzuki
Application Number:
JP2011214222A
Publication Date:
May 11, 2016
Filing Date:
September 29, 2011
Export Citation:
Assignee:
TORAY INDUSTRIES,INC.
International Classes:
B32B3/30; B32B9/04; C01B33/113; H01L21/027
Domestic Patent References:
JP2008068611A | ||||
JP11314927A | ||||
JP2009088376A | ||||
JP10158594A | ||||
JP2003025794A |
Previous Patent: An information processor, a method, a program, and a recording medium
Next Patent: METHOD OF TRANSPORTING SHROUD
Next Patent: METHOD OF TRANSPORTING SHROUD