Title:
A mass module including the peripheral circuit using the circuit board and the circuit board concerned for peripheral circuits of a mass module
Document Type and Number:
Japanese Patent JP6114691
Kind Code:
B2
Abstract:
[Subject] The present invention has an objective to provide a circuit board for a peripheral circuit which can transmit outside heat which generates from a high exothermic element, such as a power semiconductor element, while attaining reduction in size and weight, reduction in surge, and reduction in a loss, in high-capacity modules including power modules, such as an inverter. [Solution Means] In a high-capacity module, by laminating a peripheral circuit using a ceramic circuit board with electrode(s) constituted by thick conductor and embedded therein on a highly exothermic element, overheating of the module is prevented by effective heat dissipation via the circuit board while attaining reduction in size and weight, reduction in surge, and reduction in a loss in the module.
Inventors:
Takami Hirai
Shino Yano
Tsutomu Nanataki
Hirofumi Yamaguchi
Shino Yano
Tsutomu Nanataki
Hirofumi Yamaguchi
Application Number:
JP2013515047A
Publication Date:
April 12, 2017
Filing Date:
April 10, 2012
Export Citation:
Assignee:
Nippon Insulator Co., Ltd.
International Classes:
H01L23/12; H01L23/36; H01L25/07; H01L25/18
Domestic Patent References:
| JP2004172211A | 2004-06-17 | |||
| JPH02177391A | 1990-07-10 | |||
| JPH03268393A | 1991-11-29 | |||
| JPH06296084A | 1994-10-21 | |||
| JP2003017658A | 2003-01-17 | |||
| JP2004087927A | 2004-03-18 | |||
| JPS62189790A | 1987-08-19 |
Foreign References:
| WO2013001999A1 |
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita