Title:
A medium union device and a medium arrangement device
Document Type and Number:
Japanese Patent JP6127686
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To bind media with high quality.SOLUTION: According to a binding control part 20 of a bill binding part 14, a heater 33 is contacted to an overlapped part of a tape 23 wound around a bill bundle BB to heat the overlapped part for welding it, and while the heater 33 is pressed against the overlapped part of the tape 23, the tape is then moved to the vicinity of a portion being held by holders 41B and 42B of a holding part 30, and while the tape 23 is pressed to the bill bundle BB by the heater 33, the holders 41B and 42B of the holding part 30 are pulled out. Therefore, the bill binding part 14 significantly reduces the possibility that the tape 23 is pulled out to a lateral direction with the holders 41B and 42B to enter an irregular state, or the possibility that the welded portion of the tape 23 is peeled, allowing the bill bundle BB to be bound in a state where the tape 23 is wound around the bill bundle BB neatly without irregularities.
Inventors:
Yuta Iwao
Toru Nagaoka
Tomonori Takai
Toru Nagaoka
Tomonori Takai
Application Number:
JP2013090030A
Publication Date:
May 17, 2017
Filing Date:
April 23, 2013
Export Citation:
Assignee:
Oki Electric Industry Co., Ltd.
International Classes:
B65B13/10; B65B27/08; G07D9/00
Domestic Patent References:
| JP3084707U | ||||
| JP2010126206A | ||||
| JP2002179011A | ||||
| JP60167839A | ||||
| JP5310218A | ||||
| JP1099918A | ||||
| JP1308715A |
Foreign References:
| WO2008117512A1 | ||||
| US20050183398 |
Attorney, Agent or Firm:
Keiki Tanabe
Koichi Okuda
Koichi Okuda
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