Title:
The member for semiconductor manufacturing devices
Document Type and Number:
Japanese Patent JP5968651
Kind Code:
B2
Abstract:
An electrostatic chuck is provided with a ceramic substrate 12 in which an electrode 14 is embedded, an electrode terminal 14a exposed at the bottom of a concave portion 16 disposed on the back surface of the ceramic substrate 12, a power feed member 20 to supply an electric power to the electrode 14, and a joining layer 22 to connect this power feed member 20 to the ceramic substrate 12. The joining layer 22 is formed by using a AuGe based alloy, a AuSn based alloy, or a AuSi based alloy. The ceramic substrate 12 and the power feed member 20 are selected in such a way that the thermal expansion coefficient difference D calculated by subtracting the thermal expansion coefficient of the ceramic substrate 12 from the thermal expansion coefficient of the power feed member 20 satisfies −2.2≰D≰6 (unit: ppm/K).
Inventors:
Masahiro Kuda
Toru Hayase
Yuji Katsuta
Toru Hayase
Yuji Katsuta
Application Number:
JP2012058586A
Publication Date:
August 10, 2016
Filing Date:
March 15, 2012
Export Citation:
Assignee:
Nippon Insulator Co., Ltd.
International Classes:
H01L21/683; C04B37/02; C23C16/458
Domestic Patent References:
| JP2009188394A | ||||
| JP11012053A | ||||
| JP2004259805A | ||||
| JP2010263050A | ||||
| JP2001237304A | ||||
| JP2003212670A | ||||
| JP2001057468A |
Attorney, Agent or Firm:
Aitec International Patent Office