Title:
The method of assembling an electric component on a flexible substrate, a device, and the assembly object of an electric component and a flexible substrate
Document Type and Number:
Japanese Patent JP6148176
Kind Code:
B2
Abstract:
A method is presented for assembling a component (30) with a flexible substrate (10), the component having electric contacts (31). The method comprises the steps of
- placing the component (30) on a first main side (11) of the substrate,
- applying a machine vision step to estimate a position of the electric contacts,
- depositing one or more layers (32) of an electrically conductive material or a precursor thereof, said layer extending over an area of the substrate defined by the component to laterally beyond said area,
- calculating partitioning lines depending on the estimated position of the electric contacts,
- partitioning the layer into mutually insulated areas (32d) by locally removing material from said layer along said partitioning lines. Also an apparatus is presented that is suitable for carrying out the method. In addition an assembly is present that can be obtained by the method and the apparatus according to the invention.
Inventors:
Jerun Van den Brandt
Ruhr Henry Louis Coustels
Andreas Heinrich Dietzel
Ruhr Henry Louis Coustels
Andreas Heinrich Dietzel
Application Number:
JP2013541948A
Publication Date:
June 14, 2017
Filing Date:
December 02, 2011
Export Citation:
Assignee:
Netherlandse Organisati Fall Tohepasto-Naturwetens Happelike Ondelsouk Tenou
International Classes:
H05K3/32; H01L21/50; H05K3/34
Domestic Patent References:
| JP5445574A |
Foreign References:
| WO2010071426A1 |
Attorney, Agent or Firm:
Yasuhiko Murayama
Shinya Mitsuhiro
Tatsuhiko Abe
Shinya Mitsuhiro
Tatsuhiko Abe
Previous Patent: The method and constituent for the disposal of the fluid storage in the retina and/or under the reti...
Next Patent: JPS6148177
Next Patent: JPS6148177