Title:
半導体ウェハの同時両面機械加工のための両面研削盤における研削スピンドル位置の修正のための方法および当該方法を実施するための装置
Document Type and Number:
Japanese Patent JP4921444
Kind Code:
B2
Abstract:
Correction of grinding spindle positions in double-side grinding machines for the simultaneous double-side machining of semiconductor wafers is achieved by torsionally coupling the two grinding spindles, each comprising a grinding disk flange for receiving a grinding disk, and providing a measuring unit with an inclinometer and two sensors for distance measurement, between the two grinding disk flanges such that the grinding spindles are essentially in the position they would have with mounted grinding disks during the grinding process, wherein the coupled grinding spindles are rotated while inclinometer and sensors determine radial and axial correction values of axial alignment to adjust the grinding spindles to a symmetrical orientation. The spindle positions may be corrected under the action of process forces.
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Inventors:
Joachim Junge
Robert Weiss
Robert Weiss
Application Number:
JP2008268225A
Publication Date:
April 25, 2012
Filing Date:
October 17, 2008
Export Citation:
Assignee:
Siltronic AG
International Classes:
B24B45/00; B24B7/17; B24B37/08; B24B41/047; B24B49/00; B24B49/10; H01L21/304
Domestic Patent References:
| JP11254312A | ||||
| JP2001062718A | ||||
| JP2002292558A |
Foreign References:
| WO2004033148A1 | ||||
| WO2000067950A1 | ||||
| DE102004053308A1 |
Attorney, Agent or Firm:
Fukami patent office