Title:
少なくとも1つの電子構成部品をプリント回路基板に組み込むための方法、およびプリント回路基板
Document Type and Number:
Japanese Patent JP2011522403
Kind Code:
A
Abstract:
This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).
Inventors:
Bayhislberger, Guyunter
Kriechbaum, Arno
Morianz, Mike
Haslebner, Nikolai
Schutter, Johannes
Herring frits
Fredle, Gerhard
Celtic cherie tucie, Andrea
Beesley,mark
Turku, Andreas
Schuridt Beezer, Wolfgang
Kriechbaum, Arno
Morianz, Mike
Haslebner, Nikolai
Schutter, Johannes
Herring frits
Fredle, Gerhard
Celtic cherie tucie, Andrea
Beesley,mark
Turku, Andreas
Schuridt Beezer, Wolfgang
Application Number:
JP2011510779A
Publication Date:
July 28, 2011
Filing Date:
May 29, 2009
Export Citation:
Assignee:
AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
International Classes:
H05K3/46
Domestic Patent References:
| JPH01115247U | 1989-08-03 | |||
| JP2007535156A | 2007-11-29 | |||
| JP2007288109A | 2007-11-01 | |||
| JP2004200201A | 2004-07-15 | |||
| JP2007150202A | 2007-06-14 |
Attorney, Agent or Firm:
Kawaguchi International Patent Office