Title:
コーティングされたプロセスチャンバ要素の製造方法。
Document Type and Number:
Japanese Patent JP2005514521
Kind Code:
A
Abstract:
A method of fabricating a process chamber component that has a ceramic form with grains and grain boundary regions. In the method, the component is bead blasted to provide a surface having a relatively low roughness average of less than about 150 microinches. The component is dipped into a solution having a concentration that is sufficiently low to reduce etching of grain boundary regions of the ceramic form. A metal coating is formed over at least a portion of the ceramic form. The component fabricated by this method can tolerate thicker deposits of sputtered material in a sputtering process without the sputtered deposit accumulates causing spalling of the coating of the component.
Inventors:
Hyeonshan
One phone
Stowe Clifford
One phone
Stowe Clifford
Application Number:
JP2003558891A
Publication Date:
May 19, 2005
Filing Date:
November 19, 2002
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
C04B41/51; C04B41/88; C23C4/02; C23C4/08; H05H1/46; C23C4/12; C23C14/00; C23C14/56; (IPC1-7): C23C14/00; C23C4/02; C23C4/08
Attorney, Agent or Firm:
Sadao Kumakura
Fumiaki Otsuka
Toshio Imajo
Takaki Nishijima
Fumiaki Otsuka
Toshio Imajo
Takaki Nishijima