Title:
A method of manufacturing a conductive substrate with which a plurality of conductive wiring was formed using a printing method and the printing method, and a printer
Document Type and Number:
Japanese Patent JP6146647
Kind Code:
B2
Inventors:
Kenichi Ogawa
Application Number:
JP2012288660A
Publication Date:
June 14, 2017
Filing Date:
December 28, 2012
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
B41F17/14; B41F3/20; B41F35/00; B41M1/02; H05K3/12
Domestic Patent References:
| JP2011096225A | ||||
| JP2011056839A | ||||
| JP2008246829A | ||||
| JP2009541095A |
Attorney, Agent or Firm:
Hiroyuki Nagai
Hirohito Katsunuma
Katsuomi Isogai
Yukihiro Hotta
Kazuo Okamura
Hirohito Katsunuma
Katsuomi Isogai
Yukihiro Hotta
Kazuo Okamura
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