Title:
The method of pre texturing of a chemical machinery polish layer
Document Type and Number:
Japanese Patent JP6164963
Kind Code:
B2
Abstract:
A method for pretexturing the polishing surface of a chemical mechanical polishing layer, comprising providing a chemical mechanical polishing layer having a polishing surface; providing a belt sanding machine; feeding the chemical mechanical polishing layer through a gap between a transport belt and a calibrating sanding belt of the belt sanding machine; and, wherein the polishing surface comes into contact with the calibrating sanding belt; wherein the thickness of the polishing layer is reduced.
Inventors:
John Henry Nanley Jr.
Andrew M. Geiger
Jeffrey H. Benedict
Andrew M. Geiger
Jeffrey H. Benedict
Application Number:
JP2013155866A
Publication Date:
July 19, 2017
Filing Date:
July 26, 2013
Export Citation:
Assignee:
Rohm and Haas Electronic Materials CMP Housings, Inc.
International Classes:
B24B21/08; B24B21/00
Domestic Patent References:
| JP2005333121A | ||||
| JP5029663U | ||||
| JP59212513A | ||||
| JP2008057657A | ||||
| JP7310742A | ||||
| JP2004322243A | ||||
| JP2010208017A | ||||
| JP2269552A | ||||
| JP2000296457A |
Foreign References:
| US6089958 | ||||
| US20040157531 | ||||
| US5547448 |
Attorney, Agent or Firm:
Patent business corporation Tsukuni
Hajime Tsukuni
Keiko Ozawa
Toshio Miyake
Yasuhiro Oguni
Yoko Tanaka
Yoshinori Ikukawa
Akio Shibata
Takashi Ishioka
Hajime Tsukuni
Keiko Ozawa
Toshio Miyake
Yasuhiro Oguni
Yoko Tanaka
Yoshinori Ikukawa
Akio Shibata
Takashi Ishioka
Previous Patent: A lighting installation and a platform lighting system
Next Patent: VERTICAL POSITION ADJUSTING CIRCUIT
Next Patent: VERTICAL POSITION ADJUSTING CIRCUIT