Title:
撥水性表面および親水性裏面を有するチップを製造する方法
Document Type and Number:
Japanese Patent JP5411395
Kind Code:
B1
Abstract:
In order to provide a novel method for producing a chip having a water-repellent obverse surface and a hydrophilic reverse surface, the characteristic of the present disclosure lies in that the obverse surface of the chip having a hydroxyl group is brought into contact with an organic solvent in which R1—Si(OR2)3 or R1—SiY3 is dissolved in a second hydrophobic solvent, while the reverse surface of the chip is protected by the water film, so as to form a water-repellent film on the obverse surface of the chip.
Inventors:
Hidekazu Arase
Tomoyuki Komori
Tomoyuki Komori
Application Number:
JP2013537960A
Publication Date:
February 12, 2014
Filing Date:
March 14, 2013
Export Citation:
Assignee:
Panasonic Corporation
International Classes:
B32B18/00; B32B5/14; B32B37/00; H01L21/461
Domestic Patent References:
| JP2010504428A | 2010-02-12 | |||
| JP2010065320A | 2010-03-25 | |||
| JP2005051117A | 2005-02-24 | |||
| JPS60229932A | 1985-11-15 | |||
| JP2000103007A | 2000-04-11 |
Foreign References:
| WO2011081095A1 | 2011-07-07 | |||
| US20090265629A1 | 2009-10-22 |
Attorney, Agent or Firm:
Mitsuo Tanaka
Samejima Mutsumi
Hiroshi Okabe
Kazuhisa Inaba
Samejima Mutsumi
Hiroshi Okabe
Kazuhisa Inaba