Title:
繊維質層を重ね合わせて繊維質基板を製造する方法、およびその方法により得られた基板
Document Type and Number:
Japanese Patent JP3681755
Kind Code:
B2
Abstract:
Making fibrous substrates. The method consists for a given substrate thickness in adopting a displacement step size that varies in application of a step size reduction relationship adopted to impart constant thickness to the various superposed and bonded-togehter layer thickness making up said substrate thickness. Application to manufacturing friction parts.
Inventors:
Duval, Renault, Jean, Raymon, Roger
Kurelle, Jean-Louis, Maurice
Pyrodon, Jean Pascal
Kurelle, Jean-Louis, Maurice
Pyrodon, Jean Pascal
Application Number:
JP51367896A
Publication Date:
August 10, 2005
Filing Date:
October 18, 1995
Export Citation:
Assignee:
Carvone Andustri
Societe Uropeenne de Propulsion
Societe Uropeenne de Propulsion
International Classes:
D04H1/4242; D04H1/4374; D06M17/00; D04H1/46; D04H13/00; D04H13/02; D04H18/00; D04H18/02; (IPC1-7): D04H18/00
Domestic Patent References:
| JP62006956A |
Attorney, Agent or Firm:
Yasunori Otsuka
Kenichi Matsumoto
Kenichi Matsumoto