Title:
組成物および高い伝導性を有するパターニングされた金属層の提供方法
Document Type and Number:
Japanese Patent JP2011503348
Kind Code:
A
Abstract:
Disclosed is a method for making a metal pattern with high conductivity comprising providing a patterned substrate comprising a patterned catalyst layer on a base substrate by a thermal imaging method followed by plating to provide the metal pattern. The metal patterns provided are suitable for electrical devices including electromagnetic interference shielding devices and touchpad sensors.
Inventors:
Feng Gao
Linda Kay Johnson
Loupan leon kuseiyan
Darren E Keys
Irina Malajovic
Rinaldo Soria Sifino
Fredric Claus Mustemg Jr.
Linda Kay Johnson
Loupan leon kuseiyan
Darren E Keys
Irina Malajovic
Rinaldo Soria Sifino
Fredric Claus Mustemg Jr.
Application Number:
JP2010531216A
Publication Date:
January 27, 2011
Filing Date:
October 23, 2008
Export Citation:
Assignee:
E.I.DU PONT DE NEMOURS AND COMPANY
International Classes:
C23C18/18; C25D5/02; C25D5/54; H01B5/14; H01B13/00; H05K9/00
Attorney, Agent or Firm:
Junji Yuda
Noriyuki Takebayashi
Noriyuki Takebayashi