Title:
ポリフェニレンサルファイド樹脂製回路基板用離型フィルム及び積層体
Document Type and Number:
Japanese Patent JP5587771
Kind Code:
B2
Inventors:
Miyazaki Mallow
Hiroyuki Oba
Tomonori Hosoda
Masayuki Okura
Hiroyuki Oba
Tomonori Hosoda
Masayuki Okura
Application Number:
JP2010514446A
Publication Date:
September 10, 2014
Filing Date:
May 19, 2009
Export Citation:
Assignee:
KUREHA CORP.
International Classes:
B29C33/68; C08J5/18; C08L25/04; C08L81/02; B29K25/00; B29K81/00
Domestic Patent References:
| JPS6445438A | 1989-02-17 | |||
| JP2007169521A | 2007-07-05 | |||
| JPH02175228A | 1990-07-06 | |||
| JP2007246650A | 2007-09-27 | |||
| JP2004051688A | 2004-02-19 | |||
| JPS6445438A | 1989-02-17 | |||
| JP2007169521A | 2007-07-05 |
Attorney, Agent or Firm:
Kaoru Watanabe