Title:
多層基板
Document Type and Number:
Japanese Patent JP7207382
Kind Code:
B2
Abstract:
Provided is a multilayer substrate obtained by laminating semiconductor substrates each having a trough electrode. The multilayer substrate has excellent conduction characteristics and can be manufactured at low cost. Conductive particles are each selectively present at a position where the through electrodes face each other as viewed in a plan view of the multilayer substrate. The multilayer substrate has a connection structure in which the facing through electrodes are connected by the conductive particles, and the semiconductor substrates each having the through electrode are bonded by an insulating adhesive.
Inventors:
Kyushi Akutsu
Tomoyuki Ishimatsu
Tomoyuki Ishimatsu
Application Number:
JP2020161099A
Publication Date:
January 18, 2023
Filing Date:
September 25, 2020
Export Citation:
Assignee:
Dexerials Co., Ltd.
International Classes:
H01L25/07; H01L23/36; H01L25/065; H01L25/18
Domestic Patent References:
| JP2006245311A | ||||
| JP3062411A | ||||
| JP4301382A |
Foreign References:
| US20140335656 | ||||
| WO2014034741A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Taji International Patent Office