Title:
The multiple attachment object of the multiple attachment object of a leadframe, a leadframe with resin, and a leadframe, the multiple attachment object of a leadframe with resin, an optical semiconductor device, and an optical semiconductor device
Document Type and Number:
Japanese Patent JP6197297
Kind Code:
B2
Inventors:
Kazunori Oda
Megumi Oishi
Megumi Oishi
Application Number:
JP2013015891A
Publication Date:
September 20, 2017
Filing Date:
January 30, 2013
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H01L33/62; H01L23/48
Domestic Patent References:
| JP2012195430A | ||||
| JP2009141455A | ||||
| JP2010238833A | ||||
| JP2011151069A |
Attorney, Agent or Firm:
Masayuki Masabayashi
Tetsuo Shiba
Hayashi Ichiyoshi
Tetsuo Shiba
Hayashi Ichiyoshi