Title:
METHOD FOR FORMING BUMP ELECTRODE ON BOARD
Document Type and Number:
Japanese Patent JPH0669282
Kind Code:
A
Abstract:
PURPOSE: To simply and effectively form bump electrodes on electrode pads on a ceramic board.
CONSTITUTION: The method for forming bump electrodes on a board comprises the steps of forming recess holes corresponding to positions of electrode pads with both end faces 11a, 13a as references on a recess plate 13 to be superposed on a ceramic board 11 having the pads formed on its surface, so superposing the plate 13 filled with solder paste in the recess holes upside down on the board 11 that the end faces 11a, 13a coincide, heating to melt the paste in this state, and then separating the plate 13 from the board 11. Thus, the bump electrodes 16 can be formed on the pads of the board 11.
Inventors:
BANDAI HARUFUMI
KARAKI SHINTARO
MATSUI HIROSHI
SUGO KIMIHIDE
KARAKI SHINTARO
MATSUI HIROSHI
SUGO KIMIHIDE
Application Number:
JP24270992A
Publication Date:
March 11, 1994
Filing Date:
August 18, 1992
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H01L21/60; H01L23/12; H05K3/24; H05K3/34; (IPC1-7): H01L21/60; H01L23/12; H05K3/24; H05K3/34
Attorney, Agent or Firm:
Akira Wada