Title:
新規な感光性樹脂組成物とその製造方法およびそれを用いたフレキシブルプリント配線基板とその製造方法
Document Type and Number:
Japanese Patent JP6764680
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition showing excellent flexibility, low warpage, durability against a gold plating chemical solution or a flux solder, and adhesiveness to a substrate, and showing little change in characteristics of a cured film during a mounting process, and a cured film, a flexible printed wiring board with a cured film, and methods for manufacturing them.SOLUTION: The photosensitive resin composition comprises (A) a base binder polymer, (B) a composition for modifying an insulating film, (C) a photopolymerization initiator, and (D) a solvent. The (A) component comprises two compounds of (a1) a compound having at least one active energy ray-reactive group and a structure selected from an ether bond, ester bond, carbonate bond, urethane bond, imide bond, urea bond and amide acid bond in the molecule, and (a2) a compound having at least one carboxyl group and a structure selected from an ether bond, ester bond, carbonate bond, urethane bond, imide bond, urea bond and amide acid bond in the molecule. The (B) component comprises two or more types of particles having different volume average particle diameters from each other.SELECTED DRAWING: None
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Inventors:
Tetsuya Ogiso
Tomohiro Yoshida
Kido Masayoshi
Asahina Yuji
Tomohiro Yoshida
Kido Masayoshi
Asahina Yuji
Application Number:
JP2016093209A
Publication Date:
October 07, 2020
Filing Date:
May 06, 2016
Export Citation:
Assignee:
Kaneka Corporation
International Classes:
G03F7/027; C08F290/06; G03F7/004; G03F7/035; H05K3/28
Domestic Patent References:
| JP2015011265A | ||||
| JP2015161764A | ||||
| JP2017161636A |
Foreign References:
| WO2012147745A1 |
Attorney, Agent or Firm:
Harakenzo world patent & trademark