Title:
An optical hardenability adhesive composition and its use
Document Type and Number:
Japanese Patent JP6046135
Kind Code:
B2
Abstract:
The present invention relates to a photocurable adhesive composition and the use of the same. Specifically, said photocurable adhesive composition mainly comprises, based on 100 parts by weight of the adhesive composition, component A: from 70 to 99 parts by weight of one or more polymers carrying (meth)acryloxyl group; component B: from 0 to 30 parts by weight, preferably from 0 to 25 parts by weight of one or more (meth)acrylates monomers; component C: from 0.5 to 10 parts by weight of at least one UV absorber; and component D: from 0 to 5 parts by weight of antioxidant. The present invention also relates to the use of the adhesive composition mentioned above in the production of an ITO substrate for temporarily bonding a substrate and a temporary carrier and going through a high temperature processing, for example, at a temperature of ≧160° C., preferably, from 160° C. to 260° C., more preferably from 240° C. to 250° C.
Inventors:
One james
Rou Daniel
Rou Daniel
Application Number:
JP2014521918A
Publication Date:
December 14, 2016
Filing Date:
July 05, 2012
Export Citation:
Assignee:
HENKEL CHINA CO. LTD.
HENKEL CORPORATION
HENKEL CORPORATION
International Classes:
C09J109/00; C09J4/02; C09J4/06; C09J5/00; C09J11/06; C09J115/00; C09J151/00; G03F7/00
Domestic Patent References:
| JP2009299037A | ||||
| JP2005060465A | ||||
| JP2003522229A | ||||
| JP2011032409A | ||||
| JP2005076017A | ||||
| JP2006282911A | ||||
| JP2009531516A | ||||
| JP2013253117A |
Foreign References:
| WO2007080936A1 | ||||
| WO2012005169A1 |
Attorney, Agent or Firm:
Mitsuo Tanaka
Hiroshi Yamazaki
Kenichi Morizumi
Kajita Marina
Hiroshi Yamazaki
Kenichi Morizumi
Kajita Marina
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