Title:
銅／酸化銅微粒子ペースト
Document Type and Number:
Japanese Patent JP7434786
Kind Code:
B2
Abstract:
To provide copper/copper oxide fine particles which can be fused and joined by low-temperature sintering by specifying a low-temperature sintering range of the copper/copper oxide fine particles.SOLUTION: As a result of intensive studies in order to solve the above problems, the inventors have clarified that copper/copper oxide fine particles having an average primary particle diameter (DTEM) of less than 100 nm in which the value obtained by dividing the peak intensity value of the plane index (111) plane of Cu2O by the peak intensity value of the plane index (111) plane of Cu is 0.008 to 0.3, which are acquired by X-ray diffraction using Kα rays of Cu as a radiation source, can be used as a main bonding agent for a bonding material. The copper/copper oxide fine particles can bind a plurality of metal members to each other under a non-pressurized condition and at a low temperature of 250°C or lower. Fusion bonding and joining is possible by low-temperature sintering.SELECTED DRAWING: Figure 3
Inventors:
Ryota Yamaguchi
Makoto Yada
Makoto Yada
Application Number:
JP2019177078A
Publication Date:
February 21, 2024
Filing Date:
September 27, 2019
Export Citation:
Assignee:
DIC Corporation
International Classes:
B22F1/00; B22F1/142; B22F7/08; H01B1/22
Domestic Patent References:
| JP2017123326A | ||||
| JP2010209421A | ||||
| JP4697356B1 | ||||
| JP2015210973A | ||||
| JP2019002054A | ||||
| JP2014118586A | ||||
| JP2009161838A |
Foreign References:
| WO2015162881A1 | ||||
| WO2016121749A1 | ||||
| WO2016052373A1 |
Other References:
The Journal of Physical Chemistry B,米国,2005年10月15日,Vol. 109,p. 20669-20672
Attorney, Agent or Firm:
Shinji Ogawa
Akihiro Iwamoto
Takayuki Ohno
Akihiro Iwamoto
Takayuki Ohno
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