Title:
The package for OPTO semiconductor device storage, and the mounting structure object provided with this
Document Type and Number:
Japanese Patent JP6051095
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a package for accommodating an optical semiconductor element capable of suppressing a positional deviation of a ferrule and capable of improving optical connectivity between the optical semiconductor element and the ferrule.SOLUTION: A package 3 for accommodating an optical semiconductor element comprises a circuit board 31 having a principal surface, a frame body 32 disposed on the principal surface of the circuit board 31 and having a side part 321 in which a through-hole is formed, a ferrule 33 disposed on the inside and outside of the frame body 32 through the through-hole of the frame body 32, and a holding member 34 disposed on a side part 321 on the outside of the frame body 32 and having a holding hole for holding the ferrule 33. The side part 31 has a notch C extending from an inner surface of the through-hole to a side part 321 on the outside. The holding member 34 is joined to the notch C via a joining member, and at least part of the inner surface of the notch C is apart from the holding member 34.
Inventors:
Takeo Satake
Daisuke Sakumoto
Daisuke Sakumoto
Application Number:
JP2013092652A
Publication Date:
December 27, 2016
Filing Date:
April 25, 2013
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
G02B6/42; H01L31/0232; H01S5/022
Domestic Patent References:
| JP2001068691A |
Foreign References:
| WO2012043623A1 |