PACKAGE - TOPPAN PRINTING CO LTD

Title:

PACKAGE

Document Type and Number:

Japanese Patent JP2023089589

Kind Code:

A

Abstract:

To provide a package in which a small hole for releasing vapor is to be readily formed during cooking with an electronic oven despite employing nylon.SOLUTION: A package 1 comprises an on-back seal part 3a that is heat-sealed in a convex form and end seal parts 3b and 3c that are heat-sealed in a manner crossing orthogonally thereto, in which a pair of unsealing guides 5 and 5 are provided for capturing a tear in progress upon pulling and unsealing an unsealing-start point 7 provided in the on-back seal part 3a as a start point and guiding the progress. A heat-sealable resin layer provided for heat sealing has a Young's modulus (tensile elasticity modulus), as indicated as an inclination of a linear line in an elastic deformation range of a stress-strain curve, of 0.2 giga-Pascal (GPa) or greater in measurement conforming to JIS K7127.SELECTED DRAWING: Figure 2

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