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Title:
フェーズドアレイアンテナ
Document Type and Number:
Japanese Patent JP7264884
Kind Code:
B2
Abstract:
A phased array is disclosed, comprising: a base layer comprising a substrate with a plurality of protruding posts, for stopping wave propagation along the base layer, and a printed circuit board (PCB) arranged on the base layer, and comprising at least one phased array radio frequency (RF) integrated circuit (IC) on a first side of the PCB facing the base layer and the protruding posts. The PCB further comprises feeds for transferring of RF signals from the phased array RF IC(s) to an opposite second side of the PCB. A radiating layer, comprising a plurality of radiating elements for transmitting and/or receiving RF signals from the phased array antenna is also provided, together with a feeding layer for transfer of RF signals, arranged between the feeds of the PCB on the second side and the radiating elements of the radiating layer.

Inventors:
Yang, Jean
Thomas, Emmanuelson
Ashraf, Uzzaman
Application Number:
JP2020516748A
Publication Date:
April 25, 2023
Filing Date:
September 24, 2018
Export Citation:
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Assignee:
Gap Waves Arvey
International Classes:
H01Q3/26; H01Q9/28; H01Q13/06; H01Q21/06; H01Q23/00
Domestic Patent References:
JP2017147725A
JP2017519404A
JP2012514431A
JP2001313581A
JP2003163513A
Foreign References:
WO2017086855A1
CN105428800A
WO2012128127A1
Other References:
Ashraf Uz Zaman,Gap Waveguide PMC Packaging for Improved Isolation of Circuit Components in High-Frequency Microwave Modules,IEEE Transactions on Components, Packaging and Manufacturing Technology,Volume 4, Issue 1,2013年10月18日,Pages 16-25
Attorney, Agent or Firm:
Nakamura Yukitaka
Satoru Asakura
Takeshi Sekine
Akira Akaoka
Tomoya Deguchi