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Title:
感光性組成物
Document Type and Number:
Japanese Patent JP7365460
Kind Code:
B2
Abstract:
The present invention provides a photosensitive composition comprising a semiconductor particle (A), a photopolymerizable compound (C) and a photopolymerization initiator (D), wherein the photopolymerizable compound (C) comprises a (meth)acrylate compound (C1) having a molecular weight of 180 or less.

Inventors:
Tomohiro Fukuura
Yoshihiro Harada
Keishi Komatsu
Application Number:
JP2022109807A
Publication Date:
October 19, 2023
Filing Date:
July 07, 2022
Export Citation:
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Assignee:
Sumitomo Chemical Co., Ltd.
International Classes:
C08F292/00; C08F2/44; G02B5/20
Domestic Patent References:
JP2012207084A
JP2013240979A
JP2016071362A
JP2016110065A
Foreign References:
WO2019189495A1
Attorney, Agent or Firm:
Patent Attorney Corporation ASFI International Patent Office



 
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