Title:
感光性樹脂組成物、それで構成される硬化部材、及びそれを備えた画像表示装置
Document Type and Number:
Japanese Patent JP6500458
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that can be patterned by photolithography and can form a cured member having excellent electrical reliability at a low temperature.SOLUTION: A photosensitive resin composition comprises (A) a vinyl polymer comprising a side chain α having an epoxy group, (B) a photocationic polymerization initiator, (C) an ethylenically unsaturated group-containing compound, and (D) a thermal radical polymerization initiator.SELECTED DRAWING: None
Inventors:
Eriko Toshimitsu
Application Number:
JP2015015881A
Publication Date:
April 17, 2019
Filing Date:
January 29, 2015
Export Citation:
Assignee:
Mitsubishi Chemical Corporation
International Classes:
G03F7/038; C08F2/44; G02F1/1333; G03F7/004; G03F7/031; H01L51/50; H05B33/02; H05B33/04; H05B33/10; H05B33/22
Domestic Patent References:
| JP2013076939A | ||||
| JP2004083754A | ||||
| JP2008216875A | ||||
| JP2010210654A | ||||
| JP2008020898A | ||||
| JP2005060426A | ||||
| JP2003066604A |
Foreign References:
| US20140051017 | ||||
| WO2014208653A1 | ||||
| WO2010095390A1 |