Title:
A photosensitive resin composition and a hardening film
Document Type and Number:
Japanese Patent JP6171573
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an alkali-developable photosensitive resin composition having excellent low-temperature curability, from which a cured film having high hardness, high transmittance, and excellent pattern linearity and chemical resistance can be formed, and to provide a high-quality cured film suitable for an overcoat to be used for a touch panel, by using the photosensitive resin composition.SOLUTION: The photosensitive resin composition comprises a photo-radical polymerization initiator (A), a photo-cation polymerization initiator (B), a cationic polymerizable compound (C), and an alkali-soluble resin (F). The cationic polymerizable compound (C) comprises two or more cationic polymerizable compounds including a vinyl ether compound (C1).
Inventors:
Keiichi Kondo
Akira Hirano
Masahiro Sasaki
Akira Hirano
Masahiro Sasaki
Application Number:
JP2013112919A
Publication Date:
August 02, 2017
Filing Date:
May 29, 2013
Export Citation:
Assignee:
Toyo Ink sc Holdings Co., Ltd.
Toyo Color Co., Ltd.
Toyo Color Co., Ltd.
International Classes:
G03F7/027; C07C25/02; C07C43/16; C07C43/178; C07C311/09; C07C321/30; C07C381/12; C08F2/50; C08F299/02; C08G59/18; C08G65/18; G03F7/004; G03F7/031; G03F7/038; G03F7/40
Domestic Patent References:
| JP2010169783A | ||||
| JP2011197142A | ||||
| JP2075618A | ||||
| JP6298911A | ||||
| JP5005004A |
Foreign References:
| US15605941 | ||||
| WO1985001947A1 |