Title:
A plasma treatment apparatus and a plasma processing method
Document Type and Number:
Japanese Patent JP6132688
Kind Code:
B2
Abstract:
There is provided a plasma processing apparatus which compares a plurality of patterns detected using an interference light intensity pattern using a wavelength from at least one preset film of the plurality of film layers as a parameter and an intensity pattern using a wavelength of light from the other film as a parameter and an light intensity pattern from inside the processing chamber which is detected during processing of the film to be processed; and compares a film thickness corresponding to one of the plurality of patterns having a minimum difference obtained by the comparison and a target film thickness; and determines that the thickness of the film to be processed reaches the target film thickness.
Inventors:
Kosuke Fukuchi
Shigeru Nakamoto
Taketo Usui
Tomomi Inoue
Hirota
Shigeru Nakamoto
Taketo Usui
Tomomi Inoue
Hirota
Application Number:
JP2013149021A
Publication Date:
May 24, 2017
Filing Date:
July 18, 2013
Export Citation:
Assignee:
Hitachi High-Technologies Corporation
International Classes:
H01L21/3065; H01L21/66
Domestic Patent References:
| JP2005005534A | ||||
| JP2001244254A |
Attorney, Agent or Firm:
Yuji Toda