A polish device and a grinding method of a compression wire spring

Japanese Patent JP5957150

B2

Disclosed herein is an apparatus for grinding a compression line spring. The apparatus includes a lower chain conveyor (100), an upper chain conveyor (200), and grinding units (300). The lower chain conveyor includes chain units (110) and (110') provided facing each other at positions spaced apart from each other. Each chain unit (110), (110') includes first V-shaped blocks (115) for supporting compression line springs. The upper chain conveyor includes chain units (210) and (210') provided facing each other at positions spaced apart from each other. Each chain unit (210), (210') includes second V-shaped blocks (215) for compressing downward upper portions of the compression line springs seated on the first V-shaped blocks (115) and thus supporting the compression line springs. The grinding units (300) grind seat surfaces formed on opposite ends of the compression line springs that are being moved by the lower chain conveyor and the upper chain conveyor.

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John, Chang-Gi
Yun, We Suk

JP2015542924A

July 27, 2016

December 07, 2012

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Daywon Can Up Company Limited

B24B7/16; B24B41/06; B65G17/26

JP46008789Y1
JP5024621A
JP3035913U
JP5193712A
JP51002179A
JP8133445A
JP169746C2

Tadashige Ito
Tadahiko Ito
Shinsuke Onuki

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