Title:
POLISHING LIQUID COMPOSITION FOR SAPPHIRE PLATE
Document Type and Number:
Japanese Patent JP2016117856
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide: a polishing liquid composition for a sapphire plate which has a high polishing speed and can reduce surface roughness; and a method for producing a sapphire plate and a method for polishing a sapphire plate to be polished using the polishing liquid composition.SOLUTION: There is provided a polishing liquid composition for a sapphire plate which comprises silica particles, an inorganic phosphate, an additive and an aqueous medium and has a PH of 8 or more at 25°C. The additive is composed of one or more compounds selected from an alkanolamine, a fluorine-based compound having a perfluoroalkyl group, a water-soluble vinyl-based polymer and a water-soluble polymer compound containing a polyalkylene oxide skeleton. The inorganic phosphate preferably is one or more selected from the group consisting of an orthophosphate, a phosphite and a hypophosphite.SELECTED DRAWING: None
Inventors:
OKAZAKI SHOTA
YOSHINO TAIKI
YOSHINO TAIKI
Application Number:
JP2014259298A
Publication Date:
June 30, 2016
Filing Date:
December 22, 2014
Export Citation:
Assignee:
KAO CORP
International Classes:
C09K3/14; B24B37/00; C09G1/02; H01L21/304
Domestic Patent References:
| JP2009297818A | 2009-12-24 | |||
| JP2014000641A | 2014-01-09 |
Foreign References:
| CN102358825A | 2012-02-22 | |||
| CN102775916A | 2012-11-14 |
Other References:
ADVANCED MATERIALS RESEARCH, vol. Vol.325, JPN6018041228, pages pp.457-463 (2011).
Attorney, Agent or Firm:
Ikeuchi, Sato & Partners