Title:
研磨装置
Document Type and Number:
Japanese Patent JP7353406
Kind Code:
B2
Abstract:
To provide a polishing device that can be smoothly set.SOLUTION: A polishing device 1 comprises: a polishing head 10 comprising a polishing pad 30 for polishing an upper surface of a wafer W and a housing part 12 that opens to a polishing surface 31 of the polishing pad 30; thickness measuring means 60 that comprises a sensor head 61 provided in the housing part 12 and measures a thickness of the wafer W through the opening in a non-contact manner; a feeding mechanism 40 mounted with the polishing head 10 and connected integrally to the sensor head 61, which moves up and down the polishing head 10 and the sensor head 61; and a control device 70 that controls feeding amounts of the feeding mechanism 40. The feeding mechanism 40 separates the polishing head 10 when the polishing head 10 is moved down to sit on the wafer W, and then moves down the sensor head 61 to a measurement position separated by a predetermined distance from the upper surface of the wafer W.SELECTED DRAWING: Figure 1
Inventors:
Tomohiko Makino
Application Number:
JP2022031448A
Publication Date:
September 29, 2023
Filing Date:
March 02, 2022
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
B24B37/013; B24B37/10; B24B37/12; B24B49/12; H01L21/304
Domestic Patent References:
| JP9298176A | ||||
| JP2011206881A | ||||
| JP2011224758A | ||||
| JP2015134383A | ||||
| JP2017209744A |
Attorney, Agent or Firm:
Takamitsu Shimizu
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