Title:
半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法
Document Type and Number:
Japanese Patent JP3988611
Kind Code:
B2
Inventors:
Koji Shiho
Hosaka Yukio
Toru Hasegawa
Nobuo Kawahashi
Hosaka Yukio
Toru Hasegawa
Nobuo Kawahashi
Application Number:
JP2002296798A
Publication Date:
October 10, 2007
Filing Date:
October 09, 2002
Export Citation:
Assignee:
JSR CORPORATION
International Classes:
H01L21/304; B24B37/013; B24B37/20; B24B37/24; C08J5/14; C08L15/00
Domestic Patent References:
| JP2001062703A | ||||
| JP2001334455A | ||||
| JP2003526938A | ||||
| JP2001198802A | ||||
| JP10083977A |
Attorney, Agent or Firm:
Kiyoshi Kojima
Yoshinobu Hagino
Naoya Taniguchi
Yoshinobu Hagino
Naoya Taniguchi