Title:
研磨パッド
Document Type and Number:
Japanese Patent JP7113626
Kind Code:
B2
Abstract:
The present invention is a polishing pad configured to be capable of polishing a polishing object while rotating with a polishing slurry supplied thereon, wherein the polishing pad includes a polishing layer having a polishing surface capable of polishing the polishing object, and the polishing surface includes a non-contact part formed of at least one of a recess and a through hole extending through the polishing layer, the at least one of the recess and the through hole being arranged on a concentric circle having a radius of a given length and having a center that is a rotation center of the polishing pad during rotation for polishing the polishing object.
Inventors:
Akira Ozeki
Application Number:
JP2018003472A
Publication Date:
August 05, 2022
Filing Date:
January 12, 2018
Export Citation:
Assignee:
Nitta DuPont Co., Ltd.
International Classes:
B24B37/26; H01L21/304
Domestic Patent References:
| JP2013151058A | ||||
| JP2005500174A | ||||
| JP2006289539A | ||||
| JP2008221389A | ||||
| JP11058218A | ||||
| JP2007290114A | ||||
| JP2003300149A | ||||
| JP2003260657A | ||||
| JP2002324769A | ||||
| JP2006527483A | ||||
| JP2012151501A | ||||
| JP2004082270A |
Foreign References:
| US20080125019 |
Attorney, Agent or Firm:
Fujimoto Partners Corporation
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