Title:
A polyamide compound structure and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP5911877
Kind Code:
B2
Abstract:
Disclosed herein are composite structures having improved heat aging and interlayer adhesion properties, processes for making them, and end use articles. The composite structures comprise a second component overmolded onto a first component and wherein the surface of the first and optionally of second component comprise a copper based heat stabilizer thereby providing superior bond strength between components compared to polyhydric alcohol based heat stabilizers.
Inventors:
Shen Mei Yuan
Andrey E. Area
Olaf Norbert Kirkner
Martin Douglas Wakeman
Andrey E. Area
Olaf Norbert Kirkner
Martin Douglas Wakeman
Application Number:
JP2013536793A
Publication Date:
April 27, 2016
Filing Date:
October 27, 2011
Export Citation:
Assignee:
E.I.DU PONT DE NEMOURS AND COMPANY
International Classes:
C08J5/04; C08L77/00
Domestic Patent References:
| JP2009539659A | ||||
| JP2008510040A | ||||
| JP2012515243A | ||||
| JP11198325A |
Foreign References:
| US20080008879 | ||||
| WO2010081871A1 | ||||
| WO2010081873A1 | ||||
| US20120094102 |
Attorney, Agent or Firm:
Patent Business Corporation Tani/Abe Patent Office
Previous Patent: An authentication method and an authentication device of memory storage and memory storage
Next Patent: JPS5911878
Next Patent: JPS5911878