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Title:
POLYAMIDE RESIN COMPOSITION AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2017014465
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a high molecule weight polyamide resin composition excellent in plasticization property during injection molding while maintaining high Charpy impact strength.SOLUTION: There is provided a polyamide resin composition by adding 0.0062 to 0.31 pts.mass as an elemental phosphorous of (B) triallyl phosphorous acid to 100 pts.mass of (A) a polyamide resin, melting and mixing them and having viscosity number (VN) of a polyamide resin component in the polyamide resin composition of 160 mL/g or more.SELECTED DRAWING: None

Inventors:
OKAMOTO SHINJI
SHIKANO YASUKAZU
Application Number:
JP2015135488A
Publication Date:
January 19, 2017
Filing Date:
July 06, 2015
Export Citation:
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Assignee:
ASAHI KASEI CORP
International Classes:
C08L77/00; C08K3/00; C08K5/09; C08K5/524
Domestic Patent References:
JP2001131407A2001-05-15
JP2001279092A2001-10-10
JP2001509524A2001-07-24
JP2011012151A2011-01-20
JP2010260995A2010-11-18
JP2008266497A2008-11-06
JP2011026396A2011-02-10
Foreign References:
US20140066551A12014-03-06
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito



 
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