Title:
ポリイミドボード、金属積層ポリイミドボード、およびプリント配線板
Document Type and Number:
Japanese Patent JP5556416
Kind Code:
B2
Inventors:
Jun Okamoto
Takeshi Yoshida
Tetsuo Okuyama
Toshiyuki Tsuchiya
Maeda Goshi
Takeshi Yoshida
Tetsuo Okuyama
Toshiyuki Tsuchiya
Maeda Goshi
Application Number:
JP2010141248A
Publication Date:
July 23, 2014
Filing Date:
June 22, 2010
Export Citation:
Assignee:
Toyobo Co., Ltd.
International Classes:
B32B27/34; B32B15/08; B32B15/088; C08G73/10; H05K1/03; H05K3/00; H05K3/46