Title:
POSITIONING DEVICE
Document Type and Number:
Japanese Patent JP2023151087
Kind Code:
A
Abstract:
To provide a positioning device that can heat-bond metal pattern members at an appropriate position on a substrate.SOLUTION: A pressure device (positioning device 1) that positions a metal pattern member P to be heat-bonded onto a substrate BP at a predetermined position on the substrate BP includes templates (holding jigs) 2 and 3 that hold the metal pattern member P with the metal pattern member P sandwiched between the template and the substrate BP, a pedestal plate 4 having a fixed position area on which the substrate BP and the templates 2 and 3 are placed in a stacked state, and a plurality of position correction units 9 disposed along the outer edge of the fixed position area and arranged to be thermally expandable in a direction approaching the fixed position area. The position correction unit 9 is arranged so as to be spaced apart from the outer edge of the fixed position area and to be able to contact the templates 2 and 3 with the space closed by thermal expansion.SELECTED DRAWING: Figure 2
Inventors:
SAKAI ATSUSHI
UESHIMA MASAHISA
NAKAYAMA KENTARO
YAMAGUCHI TOMOYA
UESHIMA MASAHISA
NAKAYAMA KENTARO
YAMAGUCHI TOMOYA
Application Number:
JP2022060518A
Publication Date:
October 16, 2023
Filing Date:
March 31, 2022
Export Citation:
Assignee:
DENKA CO LTD
International Classes:
H01L21/50; H05K3/20
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Takeshi Nakatsuka
Hiroyuki Nishimoto
Yoshinori Shimizu
Takeshi Nakatsuka
Hiroyuki Nishimoto
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