Title:
パワーモジュール
Document Type and Number:
Japanese Patent JP7108567
Kind Code:
B2
Abstract:
A power module includes a housing including an external terminal exposed at an outer surface of the housing, a substrate provided inside the housing, a semiconductor element mounted to the substrate, a wire connected to the semiconductor element, a metal plate terminal provided inside the housing, and a gel material provided inside the housing; the metal plate terminal connects the external terminal to an electrode of the semiconductor element; and the gel material covers the wire, the semiconductor element, the substrate, and a portion of the metal plate terminal. The metal plate terminal includes a first portion disposed inside the gel material between the wire and a top plate of the housing, a second portion bent with respect to the first portion and connected to the electrode of the semiconductor element, and a third portion extending from an end portion of the first portion toward the substrate.
Inventors:
Yu Yamamoto
Inoue Michinobu
Shinya Hayashiyama
Inoue Michinobu
Shinya Hayashiyama
Application Number:
JP2019052340A
Publication Date:
July 28, 2022
Filing Date:
March 20, 2019
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01L25/07; H01L23/24; H01L23/28; H01L23/29; H01L23/31; H01L23/48; H01L25/18
Domestic Patent References:
| JP10041460A | ||||
| JP2015115471A | ||||
| JP2011249364A | ||||
| JP2013016684A |
Foreign References:
| WO2017082122A1 | ||||
| WO2015178296A1 |
Attorney, Agent or Firm:
Hyuga Temple Masahiko
Junichi Kozaki
Hiroshi Ichikawa
Satoshi Shirai
Uchida Keito
Takeuchi Isao
Junichi Kozaki
Hiroshi Ichikawa
Satoshi Shirai
Uchida Keito
Takeuchi Isao
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