パワー半導体装置

Japanese Patent JP7290420

B2

An object of the present invention is to reduce a wiring inductance of a power semiconductor device including a smoothing capacitor and achieve miniaturization. A power semiconductor device according to the present invention includes a power semiconductor circuit section, a plurality of smoothing capacitors, a positive electrode conductor portion, a negative electrode conductor portion, and a sealing material. The plurality of smoothing capacitors form a capacitor circuit section sandwiched between the positive electrode conductor portion and the negative electrode conductor portion. The power semiconductor circuit section has a first exposure surface exposed from the sealing material and a second exposure surface that is exposed from the sealing material and provided on a side opposite to the first exposure surface. A plane with which the first exposure surface overlaps is defined as a first plane, and a plane with which the second exposure surface overlaps is defined as a second plane. The capacitor circuit section is formed so as to fit in a space between the first plane and the second plane. The positive electrode conductor portion or the negative electrode conductor portion forms a concave portion to accommodate a part of each of the plurality of smoothing capacitors.

JP4671515	Power supply device
WO/2020/183076	ISOLATED AND RECONFIGURABLE POWER CONVERTER
JP2001086768	MOBILE POWER MODULE

Masahito Mochizuki
Eiichi Ide
Hitonori Nagasaki
Shintaro Tanaka
Takashi Hirao
Junpei Kusukawa
Enjou Tsuyuno

JP2019008189A

June 13, 2023

January 22, 2019

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株式会社日立製作所

H02M7/48

JP2010205960A
JP2013162019A
JP2018082203A
JP2006032775A
JP3841007B2
JP2006040926A
JP2007215396A
JP2016195179A

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