Title:
A power semiconductor module and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP6065581
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a power semiconductor module in which deformation of a gold wire connected with a control IC can be prevented, and to provide a manufacturing method therefor.SOLUTION: A power semiconductor module includes, in a sealing resin, a power element 18 arranged at a predetermined position on a substrate 16, first aluminum wire 20p and second aluminum wire 20q connecting the power element 18 and a lead 20a for supplying power thereto, a control IC 22 arranged at a predetermined position on the substrate 16, and gold wires 24c-f connecting the control IC 22 and lead 20a. The first aluminum wire 20p and second aluminum wire 20q are arranged at a position where flow of resin, injected for forming the sealing resin, is blocked for the gold wires 24c-f.
Inventors:
Yoshizaki Shigeo
Application Number:
JP2012282419A
Publication Date:
January 25, 2017
Filing Date:
December 26, 2012
Export Citation:
Assignee:
Sanken Electric Co., Ltd.
International Classes:
H01L25/07; H01L21/56; H01L25/18
Domestic Patent References:
| JP2004296815A | ||||
| JP2008166699A | ||||
| JP2011249364A | ||||
| JP8236564A | ||||
| JP1183129A |
Foreign References:
| WO1998024122A1 | ||||
| US6002166 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu
Iwa Saki Kokuni
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu
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