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Title:
The pre-preg, the metal tension laminate sheet, the resin sheet, printed wired board, and sealing agent using a curing method, a thermosetting resin composition, and this of a thermosetting resin composition
Document Type and Number:
Japanese Patent JP6114989
Kind Code:
B2
Abstract:
A thermosetting resin composition includes a thermosetting resin containing a benzoxazine compound, and a curing accelerator containing a triazine thiol compound. The thermosetting resin contains 0.4 or less equivalents of an epoxy resin relative to one equivalent of the benzoxazine compound.

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Inventors:
Hiroaki Fujiwara
Kita Yuki
Hironori Saito
Application Number:
JP2013023572A
Publication Date:
April 19, 2017
Filing Date:
February 08, 2013
Export Citation:
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Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
C08G14/073; C08G59/40; C08K5/378; C08L61/34
Domestic Patent References:
JP2011198844A
JP2009167252A
JP2012153755A
Foreign References:
US20130270157
Attorney, Agent or Firm:
Keisei Nishikawa



 
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