Title:
プリプレグ及びその製造方法、及びこれを用いた印刷回路基板及びその製造方法
Document Type and Number:
Japanese Patent JP6414697
Kind Code:
B2
Inventors:
Kaeun-Yeon Lee
Jun-Yang Kim
Sayon Lee
Sun-Hyun Shin
Jun-Yang Kim
Sayon Lee
Sun-Hyun Shin
Application Number:
JP2015188760A
Publication Date:
October 31, 2018
Filing Date:
September 25, 2015
Export Citation:
Assignee:
Samsung Electro-Mechanics Co., Ltd.
International Classes:
C08J5/24; B29B11/16; B32B5/02; B32B15/08; B32B27/12; D04H1/4342; D04H1/728; H05K1/03
Domestic Patent References:
| JP2011068139A | ||||
| JP2013180406A | ||||
| JP2003191377A | ||||
| JP2008013872A | ||||
| JP2005200779A | ||||
| JP2011001559A | ||||
| JP2012025785A | ||||
| JP2012525719A |
Foreign References:
| US20100304108 |
Other References:
K. Bilge et.al.,Structual composites hybridized with epoxy compatible polymer/MWCNT nanofibrous interlayers,Composites Science and Technology,Elsevier,2012年 9月17日,72巻14号,1639-1645頁
Attorney, Agent or Firm:
Longhua International Patent Service Corporation