Title:
Printed wiring board material and printed wiring board using it
Document Type and Number:
Japanese Patent JP6317068
Kind Code:
B2
Inventors:
Daisuke Shibata
Takenori Sumiya
Endo Arata
Shigeru Ushiki
Takao Miwa
Takenori Sumiya
Endo Arata
Shigeru Ushiki
Takao Miwa
Application Number:
JP2013090377A
Publication Date:
April 25, 2018
Filing Date:
April 23, 2013
Export Citation:
Assignee:
Taiyo Holdings Co., Ltd.
International Classes:
H05K3/46; C08L97/02; C08L101/00; H05K1/03; H05K3/28
Domestic Patent References:
| JP2012119470A | ||||
| JP2016500379A |
Attorney, Agent or Firm:
Ichiro Honda
Yumiko Sugimoto
Atsushi Shinoda
Watari Takumi
Takashi Otaguro
Yumiko Sugimoto
Atsushi Shinoda
Watari Takumi
Takashi Otaguro