Title:
プリント回路基板
Document Type and Number:
Japanese Patent JP7238241
Kind Code:
B2
Abstract:
According to one aspect of the present invention, a printed circuit board in which a signal loss is reduced comprises: a thermosetting first resin layer; a thermoplastic second resin layer stacked on the first resin layer; a first circuit formed on a lower surface of the first resin layer; a second circuit formed on an upper surface of the second resin layer; a via hole integrally penetrating the first and second resin layers; and a plating layer formed inside the via hole and electrically connecting the first and second circuits.
Inventors:
Choi, Jun-Woo
Min, Tae Hong
Jean, Jun-Hyun
Song, Yohan
Min, Tae Hong
Jean, Jun-Hyun
Song, Yohan
Application Number:
JP2019010618A
Publication Date:
March 14, 2023
Filing Date:
January 24, 2019
Export Citation:
Assignee:
Samsung Electro-Mechanics Company Limited.
International Classes:
H05K3/46; H05K1/02; H05K3/18; H05K3/28; H05K3/38
Domestic Patent References:
| JP200976847A | ||||
| JP201274687A | ||||
| JP2003258435A | ||||
| JP20141274A | ||||
| JP2008103640A |
Attorney, Agent or Firm:
Patent Attorney Corporation RYUKA International Patent Office
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