Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
印刷装置
Document Type and Number:
Japanese Patent JP7314629
Kind Code:
B2
Abstract:
A printing apparatus includes a support portion configured to support a part of a printing medium to be transported, a heating portion configured to heat the part of the printing medium supported by the support portion, and a curved portion disposed upstream of the support portion in a transport path of the printing medium and including a curved surface that curves the transport path. The curved portion is formed of a member having a lower thermal conductivity than the support portion. In addition, the temperature of the curved portion is lower than the temperature of the support portion.

More Like This:
Inventors:
Hiroshi Toyama
Satoru Katakami
Application Number:
JP2019106836A
Publication Date:
July 26, 2023
Filing Date:
June 07, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Seiko Epson Corporation
International Classes:
B41J15/04; B41J2/01; B41J11/06; B65H20/10; B65H23/04
Domestic Patent References:
JP2018176590A
JP2018094769A
JP2018034412A
Foreign References:
WO2010087181A1
Attorney, Agent or Firm:
Satoshi Nakai
Hiroki Matsuoka
Masayuki Imamura