Title:
層状配列、高温ガス経路構成部品、および層状配列を形成するプロセス
Document Type and Number:
Japanese Patent JP6397172
Kind Code:
B2
Abstract:
The layer arrangement (100) has a substrate layer (102) and a ceramic matrix composite layer (104) in between which a non-metallic spacer (106) is formed to define the pockets. The substrate layer is formed with superalloy nickel-based or ceramic. The non-metallic spacer is provided with a thermal protecting coating and a cutting rib. The pockets are filled with the heat insulating substances. Independent claims are included for the following: (1) a hot gas path component; and (2) a method for manufacturing layer arrangement.
Inventors:
Shu Tsuan James Tsang
Haiping One
Haiping One
Application Number:
JP2013199097A
Publication Date:
September 26, 2018
Filing Date:
September 26, 2013
Export Citation:
Assignee:
GENERAL ELECTRIC COMPANY
International Classes:
B32B3/10; B32B18/00; B32B15/04; C04B37/02; F01D5/28; F01D9/02; F01D9/04; F01D25/00; F02C7/00
Domestic Patent References:
| JP2006036632A | ||||
| JP2011032167A | ||||
| JP6246890A | ||||
| JP2011167994A | ||||
| JP2004009740A | ||||
| JP2009228606A | ||||
| JP2009518270A |
Foreign References:
| US20090260364 | ||||
| US20100166565 | ||||
| US6767659 |
Attorney, Agent or Firm:
Arakawa Satoshi
Hirokazu Ogura
Toshihisa Kurokawa
Takuto Tanaka
Hirokazu Ogura
Toshihisa Kurokawa
Takuto Tanaka